A report in The Wall Street Journal talks about engineers’ efforts to break through modern microchips’ limits, using new, far better heat-dissipating materials, like diamonds or boron arsenide, than the metals we use now.
Someday, the microchips inside computers could consist of a glittering and improbable sandwich—glass on top for fast communications, a three-dimensional stack of silicon layers in the middle for processing, and a diamond wafer on the bottom to carry away all the heat, says Bechtolsheim.
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